3535 Cavities ALN

Product Category:Ceramic Thin Film Substrate(DPC)

  1. Metol Double Face ALN
  2. Front: Copper 65±15um
  3. Back: Copper 165±15um with Soldermask (Green)
  4. ENEPIG: Ni 3um,Pd0.05um,Gold≥0.05um.
  5. Copper Plating Cavity: 0.4mm+0.2mm(dam) = 0.6±0.05mm
  6. Thickness:  0.73±0.05mm(Not inclduing plating cavities)
  7. None Pre Cut
  8. Yield ≥ 92%
  9. 54.41 x 54.41mm / 144 PCS
  10. DicingSaw By 0.25mm

Modify the date:2018-12-05

Company Information


Semiconductor industry has been growing steadily and significantly. Therefore, Central Material Co., Ltd. was established

in 2014 in Taoyuan, Taiwan. In order to satisfy diversified demand for professional electronic materials and provide perfect

technical multi-supports, we are actively exploring overseasmarkets, and developing trade mark for all kinds of needs and

products. Moreover, Central Material is the exclusive agent of many well-known international manufacturers in Taiwan.

To provide safe and stable products and support semiconductor solutions with our best service platform in Asia, we continue

innovating and providing great supports to be the best partnership with our clients.