Ceramic Thin Film Substrate(DPC)
The "Thin Film" refers to the thinner thickness of conductor layer on Ceramic PCB, comparing with "Thick Film Ceramic PCB". Normally the thickness of thin film Ceramic PCB will be less than 50 micron (50um). That thin film was paurting on ceramic substrate/core.
In the same substrate using evaporation, sputtering, electroplating process, and other thin film manufacturing technology to produce passive network, and assemble on micro-components, devices separately, plus the hybrid integrated circuit formed by packaging.
According to the components parameters concentration and distribution situation in passive network, thin film ceramic PCB is divided into lumped parameter and distributed parameter. The former applies to low-frequency to microwave band, and later only applies to the microwave band.