Products Silicon Wafer Ｂt ViaFillingPlating Substrate Ceramic Thin Film Substrate(DPC) GaN LED Chip AlN Substract

AlN Substract

AlN Features

  • - High Thermal Conductivity.
  • - Coefficient of thermal expansion is silimilar to Si.
  • - Excellent isulation performance.
  • - Low dielectric constant and loss.
  • - High Purity, No Toxicity.

 

 

AlN Specification

 
NO  Content   Unit Result
1 Color ---- Grey
2 Bulk Density g/cm3 3.30
3

Surface Roughness 

Ra

 μm 0.01~0.7
4 Warp Length‰ ≤2‰
5 Strength Mpa 450
6 Moh's Hardness ---- 8
7 Conductivity of Thermal Expansion 25℃，W/(m.k) 180
8 Thermal Cofficient 10-6/℃，100℃ 4
9 Dielectric Constant 1MHz 8.8
10 Dielectric loss factor 1MHz，10-4 ≤3
11 Volume Resisitivity 25℃，Ω.cm ≥1014
12 Breakdown Strength KV/mm 17
 
 

  •  

     

Name *
Contact phone number *
Email *
Product Category * AlN Substract
Content *
Verification Code *
fe2gmb